2026 Taiwan Semiconductor Career Day｜Taiwan, CCU
Looking to build your semiconductor career in Taiwan? Join us on June 5, 2026 at National Chung Cheng University for on-site 1:1 interview opportunities with leading semiconductor companies. Participating Companies:
SPIL｜Winbond｜Himax｜CHIPBOND｜ASE
Apply by June 2 to be considered for interview opportunities. https://global.cake.me/hf1IPe
◾️Event Details Date: Friday, June 5, 2026 Time: 13:00–16:00 Venue: Banquet Hall, 3rd Floor, East Building, Administration Building, National Chung Cheng University
◾️Who Can Apply Open to international students and professionals with a bachelor’s degree or higher in STEM-related fields. Applicants must meet at least one of the following eligibility statuses: Gold Card holder, APRC holder, ROC citizen spouse residency, graduating international student in Taiwan, ARC holder with work permit, or overseas candidate requiring visa/work permit application. Required document: English or Mandarin CV
◾️Interview Application Process Apply by June 2 Get shortlisted and receive interview confirmation Attend on-site 1:1 interviews on June 5
Apply Now: https://global.cake.me/hf1IPe